EG1151 High-Power Synchronous Rectification Adjustable Buck-Boost Power Module (Supports USB Type-C PD Fast Charging Input) Open Source

Project Practice Open-Source Project
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Open-sourced a fully domestic high-power adjustable buck-boost DC-DC power module based on the EG1151 chip, supporting Type-C interface input with PD3.1 deception supporting up to 48V, as well as XT60 and DC5.5 interface inputs, maximum input/output voltage 63V, maximum input/output current 20A, supporting overcurrent protection and overtemperature protection, with maximum efficiency of 96.8%.

All components used in this module are domestically produced.

The PD3.1 deception chip model used is FS312BH, which can deceive PD chargers to output up to 48V. If the charger doesn’t support this voltage, it will automatically select the closest voltage. For example, if your PD charger supports a maximum of 28V, it will output 28V. (As of the time of writing, PD3.1 chargers on the market seem to only support a maximum output of 28V)

To input 28V through the Type-C interface, in addition to the charger supporting PD3.1 28V, your data cable needs to have an E-mark chip and support the PD3.1 ERP28V protocol.

Note: The three input interfaces cannot be used simultaneously, the input interfaces are in parallel!

Video demonstration: https://www.bilibili.com/video/BV1fS411P7Cp/

Resource download links are at the end of the article!

The maximum current design for this module is 20A, but actual testing shows it can only reach around 18A, and at 18A the voltage drop is already quite noticeable!

The design is average, experts please don’t criticize. If you think there are areas that could be improved, feel free to suggest them in the comments section. Friendly discussions are welcome.

LiChuang Open Source Platform link: https://oshwhub.com/zeruns/eg1151-da-gong-lv-tong-bu-zheng-liu-sheng-jiang-ya-mo-kuai-zhi-chi-typec-pd-kuai-chong-shu-ru

Electronics/Microcontroller Technology Exchange QQ Group: 2169025065

EG1151 Introduction

The EG1151 is a four-switch buck-boost DC-DC power management chip. It integrates reference power supply, oscillator, error amplifier, current limiting protection, short circuit protection, half-bridge driver and other functions. It can adopt corresponding control strategies based on the specific relationship between input and output voltage and different load conditions. It provides stable voltage output across the entire input voltage fluctuation range. It is particularly suitable for wide voltage range, large current buck-boost applications, especially in battery-powered situations where voltage is not constant, and also supports battery charging.

Features:

  • Wide input voltage range: 7V—150V
  • High efficiency, up to 95%
  • Undervoltage protection
  • Overtemperature protection
  • Support for battery charging
  • Output short circuit protection
  • Package form: QFN32

Physical Photos

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The enclosure is an aluminum shell purchased from Taobao, and the front and back covers are designed by myself and then 3D printed. The 3D models of the enclosure and front/back covers are also included in the materials.

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Chip Soldering Tips

The EG1151 chip package is QFN32, and the FS312BH chip package is DFN2X2-6L. Both of these packages are very small and difficult to solder, requiring some technique.

When soldering these two types of packages, if your PCB uses immersion gold process, pre-tin the pads first. If it uses tin plating process, tin the chip leads. It’s best to use medium-low temperature solder (high temperature solder is difficult to work with). Don’t apply too much solder to the middle pad, just a little bit, otherwise it will push the chip up causing the surrounding leads to lose contact. If you apply too much, clean the iron and slowly suck the solder away, or use solder wick. After tinning, apply a little flux to the pads, place the chip on top, then put it on a heating plate or use a heat gun to blow. Once the solder melts, gently move the chip with tweezers. If it self-aligns, you’re good. After cooling, check for solder bridges and handle them with the iron if needed.

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Testing

Using XT60 interface input 24V power, XT60 output interface connected to multimeter and electronic load.

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Using Type-C interface input, connected to Coolmate’s 140W PD3.1 charger, you can see it successfully deceived 28V voltage.

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Maximum output voltage is 63V.

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Thermal imaging of the module after outputting 10A current for 10 minutes. The MOS tube temperature is around 100 degrees. The contact resistance of the fuse and fuse holder may be a bit large, so the fuse area also generates more heat:

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Test equipment used:

Conversion Efficiency Test

The highest efficiency obtained from testing is 96.869%.

Test data is shown in the table below:

Input Voltage(V) Input Current(A) Input Power(W) Output Voltage(V) Output Current(A) Output Power(W) Conversion Efficiency(%)
36.000 6.932 249.552 48.194 4.996 240.777 96.484
60.000 6.264 375.840 35.669 9.995 356.512 94.857
48.000 9.434 452.832 28.841 14.993 432.413 95.491
60.000 5.941 356.460 18.430 17.988 331.519 93.003
60.000 4.270 256.200 12.129 18.990 230.330 89.902
12.001 10.913 130.967 24.003 5.002 120.063 91.674
25.000 9.915 247.875 23.749 10.008 237.680 95.887
12.004 9.889 118.708 36.068 3.002 108.276 91.213
12.004 2.291 27.501 5.070 5.000 25.350 92.178
12.004 9.130 109.597 10.116 10.013 101.292 92.422
48.000 7.812 374.976 36.188 10.005 362.061 96.556
48.000 8.658 415.584 50.315 8.001 402.570 96.869

Ripple Test

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The ripple peak-to-peak value at 12V no-load output is around 32mV:

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The ripple peak-to-peak value at 12V 10A no-load output is around 191mV:

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The ripple peak-to-peak value at 12V 15A output is around 277mV:

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The ripple peak-to-peak value at 36V no-load output is around 51mV:

The ripple peak-to-peak value at 36V 3A output is around 292mV:

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The ripple peak-to-peak value at 60V no-load output is around 114mV:

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The ripple peak-to-peak value at 60V 3A output is around 708mV:

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Schematic

Main power circuit:

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PD deception and auxiliary power circuit:

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PCB

Top layer:

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Inner layer 1:

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Inner layer 2:

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Bottom layer:

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Component Purchase Links

Most of the components used in this project can be purchased from the links here:- 0603 Resistor and Capacitor Sample Book: https://s.click.taobao.com/SXT7pkt

It is recommended to purchase components at LCSC: https://activity.szlcsc.com/invite/D03E5B9CEAAE70A4.html

In the BOM table in the LCSC open source link, click “Place Order at LCSC Now” to import all the components you need into your shopping cart with one click.

Resource Download

The download links below contain: LCSC EDA projects, schematic PDF files, datasheets for all the chips used, and 3D model files for the enclosure.

Baidu Netdisk download link: https://pan.baidu.com/s/1gNl48K25p6Pr3gi9lsyMAg?pwd=tmsv Extraction code: tmsv

123 Cloud Disk download link: https://www.123pan.com/s/2Y9Djv-r3tvH.html Extraction code: 0cGK

If you find this useful, you can tip me through the 123 Cloud Disk link above. If you’re reading this on WeChat (Official Account: zeruns-gzh), you can also click “Like Author” at the bottom of the article to tip me. Thank you.

Other Recommended Open Source Projects- Created an open-source three-phase power meter for convenient monitoring of home electricity usage: https://blog.zeruns.com/archives/771.html

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